Prerequisite |
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An undergraduate-level course on the sophomore or junior level in RLC and in TTL and MOS transistor circuit analysis. |
| Course Objectives |
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This class has been designed to equip students with the required knowledge and techniques so that they will be able to select amongst packaging and functional multi-chip partitioning alternatives so as to best meet the aim of the system and design systems to meet electrical delay, noise and other requirements, which includes determining technology details, selecting the appropriate active devices, placement and routing of the system.
A student will:
- Learn about packaging and interconnect options available, including printed circuit boards, single chip packaging, both surface mount and through-hole, and multichip modules
- Learn how to select amongst competing packaging options in order to meet system performance and cost requirements and goals
- Learn how the partitioning of a system amongst different chips and packages affects systems requirements and goals
- Learn about the fundamentals of digital circuit interconnect design, including characteristics of drivers for different logic families, impedance control, reflection noise, crosstalk noise, switching noise (ground bounce), and electromagnetic interference
- Learn how to design printed circuit board, backplane, and multichip module interconnect to achieve electrical delay and noise (signal integrity) aims
- Learn how to select (or design) drivers and receivers for different applications
- Learn about timing driven design
- Learn about the thermal design of packages
- Be exposed to industry Computer Aided Design tools that assist in this process.
- Discuss modeling and other issues associated with these tools
- Learn the principles of EMI control and discuss the associated rules
- Be exposed to the considerations associates with design for testability and design for manufacturability, with emphasis on surface mount and multichip module technologies
- Be exposed to electronic interconnect performance measurement techniques and standards.
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| Course Topics |
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Review of Electronic Interconnect Measurement Standards and Techniques
Overview of Packaging Technology Options
Relevant characteristics of digital drivers-receivers
Review of digital logic family characteristics
Timing and Noise Budgeting
Introduction to Transmission Line Theory
Delay, attenuation, and ringing
Crosstalk noise
Simultaneous Switching Noise
Power Delivery System Design
EMI and EMC guidelines
Thermal Design
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| Textbook |
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Hall, S.H., G. W. Hall and J. McCall, High-Speed Digital System Design, First Edition. Wiley-Interscience, 2000. ISBN: 0471360902.
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| Course Requirements |
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Homework: Two-week cycle (20%). Six problem sets total.
Examinations: Two midterm (25%) and a final exam (30%).
All exams are open-book and open-notes.
Projects: None
IMPORTANT NOTE: The course offered this summer was recorded during the 15-week semester at NC State University. The summer session, however, is 10 weeks in duration. Therefore, students will need to cover the course material at a considerably faster pace than during the regular semester. All course requirements must be completed during the 10-week summer session. This should be a consideration before registering for the course.
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| Software Requirements |
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Access to H-SPICE circuit simulator, or equivalent, is required. You should ensure that you have a minimum of dial-in access to the NCSU eos system if you do not have H-Spice access at your remote location. Simple remote usage instructions will be given near the start of the course. Any alternate version should be approved by the instructor at the beginning of the course. The “student” version of P-Spice is NOT adequate for this course.
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| Computer and Internet Requirements |
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NCSU has recommended minimum specifications for computers that are generally used for courses. Those specifications can be found here: http://www.ncsu.edu/it/compspecs/
Engineering Online recommends that your computer meets or exceeds the following minimum specifications below. A computer with greater capability (processor speed, RAM, internet bandwidth, disk capacity) will be more likely to properly display the video content of Engineering Online courses.
Windows:
- Microsoft Windows XP, Windows 2003, or Windows Vista
- Intel-compatible 1 GHz processor
- 512 MB RAM
- 60 GB hard drive with 1 GB free space available
- Video display at 1024 x 768 or greater
- Sound output and speakers
- Microsoft Internet Explorer 6.0 SP1 or later, Firefox 2.0 or later, or Google Chrome 1.0
- Windows Media Player 9.0 or later
- Real One Player Basic (required for certain courses)
- Adobe Acrobat Reader
- Broadband Internet connection (256 Kbps or more)
Mac OS X:
- Mac OS X 10.4.8 or later
- G4 processor
- 512 MB RAM
- 60 GB hard drive with 1 GB free space available
- Video display at 1024 x 768 or greater
- Sound output and speakers
- Safari 2.0.4 (or later) or Firefox 2.0 (or later)
- Silverlight (viewers may be prompted to install this when first viewing a presentation)
- Real One Player Basic (required for certain courses)
- Adobe Acrobat Reader
- Broadband Internet connection (256 Kbps or more)
- NOTE: The Flip4Mac plug-in causes problems when viewing Mediasite presentations and should be disabled.
Linux:
- Playback of Mediasite presentations on Linux is accomplished via the Moonlight Project, an open source implementation of Microsoft Silverlight. For more installation on the installation and configuration of Moonlight, please visit http://www.go-mono.com/moonlight/. The compatible operating systems and browsers are listed on this page.
- Microsoft Media Pack for Moonlight
- Adobe Reader for Unix
- Broadband Internet connection (256 Kbps or more)
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| Instructor |
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Dr. Robert Evans, Adjunct Assistant Professor
Dept of Electrical & Computer Engineering & Cisco Systems
North Carolina State University & Cisco Systems
Campus Box 7911
Raleigh, NC 27695-7911
Phone: (919) 392-8430
Fax: (919) 392-3299
E-Mail: bob.evans@ieee.org
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